Great News! Prof. Ricky Shi-Wei LEE, the Dean of Systems Hub, was awarded the ICEPT Outstanding Contribution Honorary Award
On August 8th, the 25th International Conference on Electronic Packaging Technology (ICEPT 2024) was inaugurated at Tianjin University. Professor Ricky Shi-Wei LEE, the Dean of the Systems Hub at the Hong Kong University of Science and Technology (Guangzhou), was honored with the ICEPT Outstanding Contribution Honorary Award.


Coinciding with the 30th anniversary of the establishment of the ICEPT conference, the organizing committee specially instituted the ICEPT Outstanding Contribution Honorary Award at this year's conference to recognize outstanding scholars who have contributed to the ICEPT series of international conferences and the advancement of domestic packaging technology. A total of five scholars were honored with this recognition.

Professor Ricky Shi-Wei LEE has long been dedicated to research in packaging and assembly technologies for microelectronics and optoelectronic devices and systems. His research areas encompass wafer-level packaging and heterogeneous integration, 3D printing for microsystem packaging, LED packaging beyond solid-state lighting and lighting applications, lead-free soldering, and reliability analysis.
Over the years, Professor Ricky Shi-Wei LEE's research achievements have been repeatedly recognized by international professional associations. In the field of electronic packaging, he was honored with the prestigious 2021 Avram Bar-Cohen Memorial Award by ASME, a leading international academic organization in the field of mechanical engineering, making him the first Chinese scientist to receive this accolade.
In April of this year, ASME awarded Professor Ricky Shi-Wei LEE the 2024 Worcester Reed Warner Medal for his pioneering contributions to "defining solder joint failure modes that impact industrial test standards."

It is understood that the International Conference on Electronic Packaging Technology (ICEPT), founded in 1994, has developed into a premier academic conference in the field of electronic packaging. It is one of the four major brand conferences in the international electronics packaging and testing field. ICEPT is committed to advancing the industry through technological innovation, academic exchange, and international cooperation. It aims to promote industrial progress through academic research exchange and foster mutual success in international cooperation to advance the dual-cycle benign development of advanced packaging both domestically and internationally.

The ICEPT 2024 conference spans three days and is expected to host around 1300 attendees, marking a record high in attendance. Participants will engage in discussions on the latest technological advancements in electronic packaging through activities such as keynote speeches, special lectures, invited talks, poster presentations, exhibitions, and parallel sessions.