Research Interest

• Additive Manufacturing
• Heterogeneous Integration
• Packaging of Microsystems
• Electronics and Optoelectronics Packaging

Biography

Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Smart Manufacturing Thrust and Dean of Systems Hub at HKUST(GZ). He also has concurrent appointments as Executive Director of Shenzhen Platform Development Office, Director of Electronic Packaging Laboratory, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. Dr. Lee has been focusing his research on the technology development for electronics/optoelectronics packaging and additive manufacturing. His R&D activities cover wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, lead-free soldering and reliability analysis. In addition to numerous technical papers in international journals and conference proceedings, Dr. Lee also co-authored 4 books and 10 book chapters. Dr. Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.